DocumentCode :
684197
Title :
Study on the relationship between decomposition characteristic components of SF6 and partial discharge quantities
Author :
Fuping Zeng ; Ju Tang ; Xiaoxing Zhang ; Jianyu Pan ; Qiang Yao ; Cunchao Wang
Author_Institution :
State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing, China
fYear :
2013
fDate :
20-23 Oct. 2013
Firstpage :
1157
Lastpage :
1160
Abstract :
To get relationship between SF6 decomposition characteristic and partial discharge capacity or discharging repetition rate, needle-plate electrode was used to simulate out-thrust insulation fault and serials of experiments were conducted. The result showed that: since the number of C atoms from stainless steel surface and content of trace H2O and O2 in gas chamber were limited, the decomposed component concentration and its effective formation rate appeared “Logistic Population Model” growth trend with the enhancement of per second discharging capacity (Qsec). It means they present “S”-curve increase with Qsec. Hence, this paper proposed C(S02F2)/C(SOF2) as the characteristic ratio (ER) to represent partial discharge energy. Besides, it defined effective energy characteristic ratio (ERRMS) and provided the relationship between ERrms and Qsec. It further obtained relationship mathematic expression between them, which could effectively show the variance regularity of partial discharge energy with Qsec.
Keywords :
SF6 insulation; decomposition; electrodes; insulation; partial discharges; stainless steel; ERRMS; H2O; O2; SF6; decomposed component concentration; decomposition characteristic; discharging repetition rate; effective energy characteristic ratio; gas chamber; logistic population; needle-plate electrode; out-thrust insulation fault; partial discharge capacity; partial discharge energy; partial discharge quantity; stainless steel surface; variance regularity; Correlation; Discharges (electric); Electrodes; Erbium; Partial discharges; Sulfur hexafluoride; Water;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/CEIDP.2013.6748286
Filename :
6748286
Link To Document :
بازگشت