• DocumentCode
    684237
  • Title

    Research on the non-linear conductivity characteristics of nano-Sic silicone rubber composites

  • Author

    Feifeng Wang ; Peihong Zhang ; Mingze Gao ; Xin Zhao ; Jinpeng Gao

  • Author_Institution
    States Key Lab. Cultivation Base of Dielectr. Eng., Harbin Univ. of Sci. & Technol., Harbin, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    435
  • Lastpage
    538
  • Abstract
    Silicon carbide (SiC) is an inorganic material which has non-linear conductivity characteristics. When mixed nano-size SiC into silicone rubber (SIR), the composites can achieve non-linear conductivity characteristics also. In this paper, the non-linear conductivity properties of 5wt%, 15wt%, 30wt%, 45wt% nano-SiC/SIR composites are investigated. The relationship between conductivity and electric field is obtained. In order to know the effect of non-linear SiC/SIR composites on homogenizing electric field, the electric stress distribution of nonlinear insulation cables termination is simulated by finite element method. The results show that the SiC/SIR composites can homogenize the electric field distribution of cable termination effectively. With the increase of non-linear conductivity level, the electric field distribution of cable termination with non-linear SiC/silicone rubber composite is more homogenization.
  • Keywords
    electric fields; electrical conductivity; finite element analysis; power cable insulation; silicon compounds; silicone rubber; wide band gap semiconductors; SiC; electric field distribution; electric stress distribution; finite element method; nonlinear conductivity; nonlinear insulation cables termination; silicone rubber composites; Conductivity; Electric fields; Power cables; Rubber; Silicon carbide; Stress; cable termination; electric field; nano-silicon carbide; silicone rubber; simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6748326
  • Filename
    6748326