DocumentCode
684243
Title
Insulation geometry independent aging sensitive parameter evaluated from transfer function of Debye model for condition assessment of oil-paper insulation
Author
Baral, A. ; Chakravorti, S.
Author_Institution
Dept. of Electr. Eng., Jadavpur Univ., Kolkata, India
fYear
2013
fDate
20-23 Oct. 2013
Firstpage
101
Lastpage
104
Abstract
Existing literature shows that lower time constant branches of insulation model represent condition of oil, whereas higher time constant branches are influenced by the condition of solid insulation. It is possible to assess the condition of oil-paper insulation by identifying the parameters of insulation model. It is understood that in addition to aging and moisture, factors like insulation geometry also affect the values of the branch parameters of insulation model. This implies parameters evaluated from one insulation model has limited potential in assessing the condition of a different transformer, even if the loading history and power rating of the two units are similar. The present paper introduces a performance parameter, which is less sensitive to insulation geometry. The parameter can be evaluated from the Transfer Function of the insulation model. It is shown that the parameter is influenced by condition of both oil and paper insulation. The performance of the proposed parameter is first tested using laboratory sample and then using data obtained from several real life power transformers.
Keywords
ageing; insulating oils; paper; power transformer insulation; transfer functions; Debye model; condition assessment; insulation geometry independent aging sensitive parameter; insulation model; loading history; oil-paper insulation; power rating; power transformers; solid insulation; transfer function; Dielectrics; Geometry; Mathematical model; Oil insulation; Power transformer insulation; Debye model; Oil-paper insulation; Transfer Function; tanδ;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location
Shenzhen
Type
conf
DOI
10.1109/CEIDP.2013.6748332
Filename
6748332
Link To Document