Title :
Symposium program
Abstract :
The following topics are dealt with: advanced packaging technology; optical transceiver module; Si photonics and single-mode optics; power integrity; signal integrity; noise suppression; 3D technology; high-speed interconnect; optics for computing; optical communication and lighting technology; microbump bonding; hybrid bonding; materials for packaging; cooling and thermal technology; reliability.
Keywords :
bonding processes; cooling; electronics packaging; elemental semiconductors; integrated circuit interconnections; integrated optics; lighting; optical communication; optical transceivers; reliability; silicon; three-dimensional integrated circuits; 3D technology; Si photonics; advanced packaging technology; cooling; high-speed interconnect; hybrid bonding; lighting technology; microbump bonding; noise suppression; optical communication; optical transceiver module; packaging materials; power integrity; reliability; signal integrity; single-mode optics; thermal technology; Educational institutions; High-speed optical techniques; Laboratories; Materials; Optical interconnections; Optical waveguides; Packaging;
Conference_Titel :
CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-2718-0
DOI :
10.1109/ICSJ.2013.6756073
