Title :
Table of contents
Abstract :
The following topics are dealt with: chip scale packaging; flip-chip devices; solder joint reliability; integrated circuit reliability; through-silicon-via; packaging design; surface mount technology; and solid state lighting packaging and integration.
Keywords :
chip scale packaging; flip-chip devices; integrated circuit reliability; light emitting diodes; solders; surface mount technology; three-dimensional integrated circuits; chip scale packaging; flip-chip devices; integrated circuit reliability; packaging design; solder joint reliability; solid state lighting packaging; surface mount technology; through-silicon-via;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2013 14th International Conference on
Conference_Location :
Dalian
DOI :
10.1109/ICEPT.2013.6756406
