DocumentCode :
68498
Title :
Highly Scalable Horizontal Channel 3-D NAND Memory Excellent in Compatibility With Conventional Fabrication Technology
Author :
Sakuma, Keita ; Kusai, Haruka ; Fujii, Shohei ; Koyama, Masanori
Author_Institution :
Corp. R&D Center, Toshiba Corp., Kawasaki, Japan
Volume :
34
Issue :
9
fYear :
2013
fDate :
Sept. 2013
Firstpage :
1142
Lastpage :
1144
Abstract :
We developed a stacked horizontal channel type floating gate (HC-FG) NAND memory; a 3-D stacked NAND array composed of conventional FG cells. With this cell structure, a wide program/erase (P/E) window is obtained, accompanied by superior read disturb immunity, P/E endurance, and data retention. In addition, we propose a low-cost layer select transistor (LST) that is easily integrated with the HC-FG cell. Because the 3-D memory composed of the HC-FG cell and the LST has good compatibility with conventional fabrication technology, further bit cost scaling is expected.
Keywords :
integrated memory circuits; logic arrays; three-dimensional integrated circuits; 3D NAND memory; 3D stacked NAND array; conventional fabrication technology; conventional floating gate cell; floating gate NAND memory; highly scalable horizontal channel; low cost layer select transistor; stacked horizontal channel type; Arrays; Ash; Fabrication; Logic gates; Scanning electron microscopy; Silicon; Transistors; 3-D NAND Flash memory; floating gate (FG) cell; stacked horizontal channel;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2013.2274472
Filename :
6574221
Link To Document :
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