Title :
Discussion group summary [5 summaries]
Abstract :
The following topics are dealt with: BEOL; reliability of future technologies; reliability challenges for foundries/fabless; RRAM.
Keywords :
foundries; integrated circuits; random-access storage; reliability; BEOL; RRAM; back end of line; fabless; foundries; reliability; Electromigration; Foundries; Materials; Reliability; Standards; Stress; Through-silicon vias;
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International
Conference_Location :
South Lake Tahoe, CA
Print_ISBN :
978-1-4799-0350-4
DOI :
10.1109/IIRW.2013.6804193
