• DocumentCode
    68635
  • Title

    High-performance stacked-coil transformers with thick metal layers

  • Author

    Cheol Ho Kim ; Bonghyuk Park

  • Author_Institution
    Electron. & Telecommun. Res. Inst., Daejeon, South Korea
  • Volume
    50
  • Issue
    19
  • fYear
    2014
  • fDate
    September 11 2014
  • Firstpage
    1359
  • Lastpage
    1361
  • Abstract
    Miniaturised stacked-coil radio-frequency (RF) transformers were fabricated with thick metal layers using the low-cost anodised aluminium substrate process. The transformer consists of a 34 μm-thick substrate-buried copper lower coil and a 30 μm-thick copper/gold upper coil with a 3 μm-thick benzocyclobutene (BCB) interlayer between the coils. Owing to extremely low losses and tight coupling, the fabricated transformers achieved very low insertion losses as low as 0.28 dB and high maximum available gains of up to 0.96 at GHz frequencies. The results verify that the stacked-coil transformer with thick metal layers can be a promising component for high-performance miniaturised RF circuits.
  • Keywords
    coils; high-frequency transformers; substrates; BCB interlayer; benzocyclobutene interlayer; copper-gold upper coil; high-performance miniaturised RF circuits; low-cost anodised aluminium substrate process; miniaturised stacked-coil RF transformers; miniaturised stacked-coil radio-frequency transformers; size 3 mum; size 34 mum; substrate-buried copper lower coil; thick metal layers;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2014.2502
  • Filename
    6898647