DocumentCode
686458
Title
DC dielectric breakdown characteristics of mesoporous-alumina/epoxy composite
Author
Kurimoto, M. ; Kusaba, D. ; Suzuki, Hajime ; Murakami, Yasutaka ; Nagao, Masaru
Author_Institution
Toyohashi Univ. of Technol., Toyohashi, Japan
fYear
2011
fDate
6-10 Sept. 2011
Firstpage
165
Lastpage
168
Abstract
This paper presents an attempt to derive the dc dielectric breakdown characteristics of polymer composite filled with the metal oxide particle which has mesoporous structure. Mesoporous-alumina/epoxy composite was fabricated by compounding epoxy resin and mesoporous-alumina particles which had the micrometric particle-diameter and the nanometric pore-size. Measurement of the specific gravity of mesoporous-alumina/epoxy composites indicated that the porosity of mesoporous-alumina particle in the epoxy matrix was higher than that of nonporous-alumina particle. From the breakdown test with using McKeown electrode, DC breakdown strength of mesoporous-alumina/epoxy composites was obtained, which was compared with DC breakdown strength of the nonporous-alumina/epoxy composites. These results suggested that the nanometric pore with wormhole structure inside mesoporous particle could not be critical defect for DC dielectric breakdown characteristics in low filler concentration.
Keywords
alumina; electric breakdown; filled polymers; mesoporous materials; resins; DC breakdown strength; DC dielectric breakdown characteristics; McKeown electrode; breakdown test; compounding epoxy resin; mesoporous alumina-epoxy composite; metal oxide particle filling; micrometric particle diameter; nanometric pore size; polymer composite; specific gravity measurement; Electric breakdown; Electrodes; Epoxy resins; Gravity; Mesoporous materials; Polymers; DC breakdown strength; Epoxy composite; Mesoporous-alumina particle; Particle porosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials (ISEIM), Proceedings of 2011 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-88686-074-3
Type
conf
DOI
10.1109/ISEIM.2011.6826375
Filename
6826375
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