• DocumentCode
    686458
  • Title

    DC dielectric breakdown characteristics of mesoporous-alumina/epoxy composite

  • Author

    Kurimoto, M. ; Kusaba, D. ; Suzuki, Hajime ; Murakami, Yasutaka ; Nagao, Masaru

  • Author_Institution
    Toyohashi Univ. of Technol., Toyohashi, Japan
  • fYear
    2011
  • fDate
    6-10 Sept. 2011
  • Firstpage
    165
  • Lastpage
    168
  • Abstract
    This paper presents an attempt to derive the dc dielectric breakdown characteristics of polymer composite filled with the metal oxide particle which has mesoporous structure. Mesoporous-alumina/epoxy composite was fabricated by compounding epoxy resin and mesoporous-alumina particles which had the micrometric particle-diameter and the nanometric pore-size. Measurement of the specific gravity of mesoporous-alumina/epoxy composites indicated that the porosity of mesoporous-alumina particle in the epoxy matrix was higher than that of nonporous-alumina particle. From the breakdown test with using McKeown electrode, DC breakdown strength of mesoporous-alumina/epoxy composites was obtained, which was compared with DC breakdown strength of the nonporous-alumina/epoxy composites. These results suggested that the nanometric pore with wormhole structure inside mesoporous particle could not be critical defect for DC dielectric breakdown characteristics in low filler concentration.
  • Keywords
    alumina; electric breakdown; filled polymers; mesoporous materials; resins; DC breakdown strength; DC dielectric breakdown characteristics; McKeown electrode; breakdown test; compounding epoxy resin; mesoporous alumina-epoxy composite; metal oxide particle filling; micrometric particle diameter; nanometric pore size; polymer composite; specific gravity measurement; Electric breakdown; Electrodes; Epoxy resins; Gravity; Mesoporous materials; Polymers; DC breakdown strength; Epoxy composite; Mesoporous-alumina particle; Particle porosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials (ISEIM), Proceedings of 2011 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-88686-074-3
  • Type

    conf

  • DOI
    10.1109/ISEIM.2011.6826375
  • Filename
    6826375