Title :
A 20-ps temperature compensated Time-to-Digital Converter (TDC) implemented in FPGA
Author :
Weibin Pan ; Guanghua Gong ; Hongming Li ; Jianmin Li
Author_Institution :
Dept. of Eng. Phys., Tsinghua Univ., Beijing, China
fDate :
Oct. 27 2013-Nov. 2 2013
Abstract :
This paper presents a temperature compensation design for carry chain based Time-to-Digital Converter (TDC) in FPGA. The bin-by-bin calibrations under different temperatures are performed for both plain TDC and Wave Union TDC to characterize the influence of temperature variation on the delay time of carry chain which shows all TDC channels have the similar temperature-LUT coefficient. Accordingly, a simplified temperature compensation scheme by using a dedicated correction channel to measure the coefficient and correct fine time result for all TDC channels is implemented and tested. This method shows only few picosecond errors for both simulation and measurement. With this compensation approach, a 21ps RMS TDC resolution has been achieved in Cyclone II FPGA under a wide temperature range from 10°C to 75°C. Several design key points are also described in this paper.
Keywords :
compensation; delays; field programmable gate arrays; integrated circuit layout; table lookup; thermal analysis; time-digital conversion; Cyclone II FPGA; RMS TDC resolution; TDC channels; bin-by-bin calibrations; carry chain; correct fine time result; correction channel; delay time; look-up table; picosecond errors; temperature 10 degC to 75 degC; temperature compensated time-to-digital converter; temperature compensation design; temperature compensation scheme; temperature-LUT coefficient; time 10 ps; time 21 ps; wave union TDC; Calibration; Clocks; Delays; Field programmable gate arrays; Table lookup; Temperature distribution; Temperature measurement; field-programmable gate array (FPGA); temperature compensation; time-to-digital converter;
Conference_Titel :
Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2013 IEEE
Conference_Location :
Seoul
Print_ISBN :
978-1-4799-0533-1
DOI :
10.1109/NSSMIC.2013.6829535