• DocumentCode
    687393
  • Title

    Characterization of microstructured semiconductor neutron detectors

  • Author

    Bellinger, S.L. ; Cooper, B.W. ; Fronk, R.G. ; Henson, L. ; Ochs, T. ; Sobering, T.J. ; McGregor, D.S.

  • Author_Institution
    SMART Lab., Kansas State Univ., Manhattan, KS, USA
  • fYear
    2013
  • fDate
    Oct. 27 2013-Nov. 2 2013
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Silicon diodes with large aspect ratio microstructures backfilled with neutron-reactive material show a dramatic increase in neutron-detection efficiency beyond that of conventional thin-film coated planar devices. Described here are advancements in applications of the technology. The highest single-chip efficiency devices thus far have delivered over 30.1% intrinsic thermal-neutron detection efficiency at normal incident, and 37.6% at a 45° incident. The detectors operate as diffused pn-junction diodes each having 4-cm2 active area. The solid-state silicon device operates on zero to 2.7V and utilizes simple signal amplification and counting electronic components. The intrinsic detection-efficiency for normal-incident 0.0253 eV neutrons was found for the detectors by calibrating against a calibrated 3He proportional counter.
  • Keywords
    helium-3 counters; neutron detection; p-n junctions; semiconductor diodes; silicon radiation detectors; 3He proportional counter; counting electronic component; diffused pn-junction diodes; intrinsic thermal-neutron detection efficiency; microstructured semiconductor neutron detectors; neutron-reactive material; planar device; signal amplification component; silicon diodes; single-chip efficiency device; solid-state silicon device; Detectors; Microstructure; Neutrons; Semiconductor device measurement; Semiconductor diodes; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2013 IEEE
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4799-0533-1
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2013.6829849
  • Filename
    6829849