Optical and Electronic Packaging Processes for Silicon Photonic Systems

Author

Pavarelli, Nicola ; Jun Su Lee ; Rensing, Marc ; Scarcella, Carmelo ; Shiyu Zhou ; Ossieur, Peter ; O´Brien, Peter A.

Author_Institution

Tyndall Nat. Inst., Univ. Coll. Cork, Cork, Ireland

Volume

33

Issue

5

fYear

2015

fDate

March1, 1 2015

Firstpage

991

Lastpage

997

Abstract

Fiber optic interconnection processes and hybrid integration of electronic devices for high speed Si photonic systems are presented. Thermal effects arising from these hybrid integration processes are also investigated. An overview of ePIXfab which offers affordable access to an advanced Si photonic foundry service is also presented. This includes the presentation of fundamental photonic packaging design rules which can greatly reduce the time and cost associated with the development of complex Si photonic devices.

Keywords

elemental semiconductors; integrated circuit packaging; integrated optics; optical interconnections; silicon; Si; ePIXfab; electronic packaging process; fiber optic interconnection process; hybrid integration process; optical packaging; photonic foundry service; photonic packaging design; silicon photonic system; thermal effect; Couplings; Optical fiber couplers; Optical fiber devices; Packaging; Photonics; Silicon; Electronics packaging; photonic integrated circuits; semiconductor device packaging; silicon photonics;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/JLT.2015.2390675

Filename

7042806