DocumentCode
689141
Title
Deposited low temperature silicon GHz modulator
Author
Lee, Y.H.D. ; Thompson, Michael O. ; Lipson, Michal
Author_Institution
Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
fYear
2013
fDate
9-14 June 2013
Firstpage
1
Lastpage
2
Abstract
We demonstrate multi gigahertz polysilicon electro-optic modulator fabricated using low temperature excimer laser annealing technique compatible with CMOS backend integration. Carrier injection modulation at 3 Gbps is achieved.
Keywords
CMOS integrated circuits; electro-optical modulation; excimer lasers; integrated optics; laser beam annealing; optical fabrication; optical materials; silicon; CMOS backend integration; Si; bit rate 3 Gbit/s; carrier injection modulation; deposited low temperature silicon GHz modulator; low temperature excimer laser annealing technique; multigigahertz polysilicon electro-optic modulator; CMOS integrated circuits; Modulation; Optical waveguides; Silicon-on-insulator;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics (CLEO), 2013 Conference on
Conference_Location
San Jose, CA
Type
conf
Filename
6833523
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