Title :
High longevity rubidium packaging method suitable for integrated optics
Author :
Giraud-Carrier, Matthieu ; Hulbert, John F. ; Wall, Thomas ; Hawkins, A.R. ; Black, J.A. ; Schmidt, Heidemarie
Author_Institution :
Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
Abstract :
We present a construction approach to long-lasting rubidium (Rb) atomic vapor cells compatible with integrated photonic platforms. Indium solder seals did not exhibit any decrease in optical atomic density after being held at 95 °C for thirty days.
Keywords :
indium; integrated optics; packaging; rubidium; seals (stoppers); solders; In; Rb; high longevity rubidium packaging method; indium solder seals; integrated optics; integrated photonic platforms; long-lasting rubidium atomic vapor cells; optical atomic density; temperature 95 degC; Atom optics; Copper; Glass; Indium; Lead; Seals; Tin;
Conference_Titel :
Lasers and Electro-Optics (CLEO), 2013 Conference on
Conference_Location :
San Jose, CA
