• DocumentCode
    689424
  • Title

    High longevity rubidium packaging method suitable for integrated optics

  • Author

    Giraud-Carrier, Matthieu ; Hulbert, John F. ; Wall, Thomas ; Hawkins, A.R. ; Black, J.A. ; Schmidt, Heidemarie

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
  • fYear
    2013
  • fDate
    9-14 June 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We present a construction approach to long-lasting rubidium (Rb) atomic vapor cells compatible with integrated photonic platforms. Indium solder seals did not exhibit any decrease in optical atomic density after being held at 95 °C for thirty days.
  • Keywords
    indium; integrated optics; packaging; rubidium; seals (stoppers); solders; In; Rb; high longevity rubidium packaging method; indium solder seals; integrated optics; integrated photonic platforms; long-lasting rubidium atomic vapor cells; optical atomic density; temperature 95 degC; Atom optics; Copper; Glass; Indium; Lead; Seals; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics (CLEO), 2013 Conference on
  • Conference_Location
    San Jose, CA
  • Type

    conf

  • Filename
    6833808
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=689424