Title :
Broadband Microwave Frequency Characterization of 3-D Printed Materials
Author :
Deffenbaugh, Paul I. ; Rumpf, Raymond C. ; Church, Kenneth H.
Author_Institution :
W.M. Keck Center for 3-D, Univ. of Texas, El Paso, TX, USA
Abstract :
3-D printing allows increased design flexibility in the fabrication of microwave circuits and devices and is reaching a level of maturity that allows for functional parts. Little is known about the RF and microwave properties of the standard materials that have been developed for 3-D printing. This paper measures a wide variety of materials over a broad spectrum of frequencies from 1 MHz to 10 GHz using a variety of well-established measurement methods.
Keywords :
microwave circuits; microwave measurement; printed circuit design; three-dimensional printing; 3D printed materials; 3D printing; RF property; broad spectrum; broadband microwave frequency characterization; design flexibility; functional parts; microwave circuit fabrication; microwave property; standard materials; well-established measurement methods; Dielectric constant; Material properties; Materials; Measurement uncertainty; Microwave circuits; Microwave measurement; Printing; Stereolithography; Three-dimensional displays; 3-D printing; direct-digital manufacturing; microwave materials measurement; printed electronics;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2013.2273306
