DocumentCode :
691135
Title :
In-Situ Temperature Monitoring and Deposition Induced Errors Calibration in Metal-Organic Chemical Vapor Deposition
Author :
Dong Yan ; Shing Man Lee ; Longmao Ye ; Linzi Wang ; Jianpeng Liu ; Yuwen Sun
Author_Institution :
Key Lab. of Microelectron. Devices & Integrated Technol., Beijing, China
fYear :
2013
fDate :
21-23 Sept. 2013
Firstpage :
897
Lastpage :
900
Abstract :
In the process of semiconductor layer growth by metal-organic chemical vapor deposition (MOCVD), temperature measurement errors occur due to deposition on the reactor view port. This temperature shift is detrimental for the fabrication of devices. In this paper, an in-situ temperature and reflectance measurement system is developed for real time observations of process temperature and characterization of growing films. Then, a dynamic correction factor is introduced in the thermal radiance equations to eliminate the deposition induced errors. Marathon process run result verifies the effect. Such an on-line self-calibrating procedure would help improve the yield of temperature sensitive epitaxial growth.
Keywords :
MOCVD; calibration; measurement errors; semiconductor device measurement; semiconductor epitaxial layers; semiconductor growth; temperature measurement; MOCVD; deposition induced errors; dynamic correction factor; growing films characterization; in-situ temperature measurement system; marathon process run; metal-organic chemical vapor deposition; online self-calibrating procedure; process temperature; reactor view port deposition; real time observations; reflectance measurement system; semiconductor layer growth; temperature measurement errors; temperature sensitive epitaxial growth; temperature shift; thermal radiance equations; Epitaxial growth; Microelectronics; Reflectivity; Semiconductor device measurement; Temperature; Temperature measurement; Temperature sensors; calibration; in-situ monitoring; metal-organic chemical vapor deposition; temperature errors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Instrumentation, Measurement, Computer, Communication and Control (IMCCC), 2013 Third International Conference on
Conference_Location :
Shenyang
Type :
conf
DOI :
10.1109/IMCCC.2013.199
Filename :
6840589
Link To Document :
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