• DocumentCode
    691311
  • Title

    A dynamic modeling of variable stiffness piezoelectric cylindrical shells under the action of temperature field

  • Author

    Jing Jiang ; Hong-hao Yue ; Lei Wang ; Xu Hou ; Yan Lv

  • Author_Institution
    Sch. of Naval Archit. & Ocean Eng., Harbin Inst. of Technol. at Weihai, Weihai, China
  • fYear
    2013
  • fDate
    25-27 Oct. 2013
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In this paper, theoretical analysis and simulation of a simply supported circular cylindrical shell under linearly changed temperature filed is proposed. The influence of material properties and internal thermal into the change to the equivalent stiffness of the structure is considered. The difference of the influence of material properties and internal thermal was discussed. A dynamic modeling of variable Stiffness cylindrical shells under the action of temperature field was built, considering the influence of Young´s modulus to the basic frequency in different modes. Based on the above theory, piezoelectric material was used as actuator to eliminate the effects of the thermal environment. And the direction of the research is to enhance the performance of the structures on the base of general materials by using smart material and effective control methods in the future.
  • Keywords
    Young´s modulus; actuators; elastic constants; intelligent materials; piezoelectric actuators; piezoelectric materials; shells (structures); Young´s modulus; actuator; circular cylindrical shell; dynamic modeling; internal thermal properties; material properties; smart material; structure stiffness; temperature field; thermal environment effects; variable stiffness piezoelectric cylindrical shells; Equations; Mathematical model; Stress; Temperature; Thermal stresses; Young´s modulus; Piezoelectric actuator; Simply supported circular cylindrical shell; Temperature field; Variable stiffness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Piezoelectricity, Acoustic Waves and Device Applications (SPAWDA), 2013 Symposium on
  • Conference_Location
    Changsha
  • Print_ISBN
    978-1-4799-3289-4
  • Type

    conf

  • DOI
    10.1109/SPAWDA.2013.6841098
  • Filename
    6841098