• DocumentCode
    69149
  • Title

    Impact of Buffer Layer on Atomic Layer Deposited TiAlO Alloy Dielectric Quality for Epitaxial-GaAs/Ge Device Application

  • Author

    Dalapati, G.K. ; Chia, C.K. ; Mahata, C. ; Krishnamoorthy, S. ; Tan, C.C. ; Tan, H.R. ; Maiti, Chinmay Kumar ; Chi, Dongzhi

  • Author_Institution
    Inst. of Mater. Res. & Eng., Agency for Sci., Technol. & Res. (A*STAR), Singapore, Singapore
  • Volume
    60
  • Issue
    1
  • fYear
    2013
  • fDate
    Jan. 2013
  • Firstpage
    192
  • Lastpage
    199
  • Abstract
    The impact of AlGaAs and AlAs buffer layers on the electrical properties of an epitaxial gallium-arsenide (epi-GaAs) metal-oxide-semiconductor capacitor (MOSC) was investigated. MOSC was fabricated by using atomic-layer-deposited Al2O3 -TiO2 (TiAlO) alloy gate dielectric and epi-GaAs layers. The epi-GaAs layer was grown on Ge substrates at 675 °C with and without buffer layer between epi-GaAs layer and Ge substrates. The TiAlO/epi-GaAs interface with an AlGaAs buffer layer allows realizing a high-quality interface between epi-GaAs layers and TiAlO dielectric, much sought after for high-speed transistor applications on a silicon platform. TiAlO dielectric is amorphous even upon annealing at 500 °C and exhibits a sharp interface with epi-GaAs layers. The choice of AlGaAs over AlAs for a buffer layer was made based on the quality of resulting TiAlO/epi-GaAs surface passivation as evident through structural and electrical characteristics. Epi-GaAs with an AlGaAs buffer layer was found to improve the performance of the MOSC significantly through increase in accumulation capacitance and breakdown voltage. The interface state density, flatband voltage, frequency dispersion, and leakage current were decreased for the MOSC fabricated with an AlGaAs buffer layer.
  • Keywords
    III-V semiconductors; MOS capacitors; aluminium alloys; aluminium compounds; annealing; atomic layer deposition; buffer layers; epitaxial layers; gallium arsenide; germanium; high-k dielectric thin films; leakage currents; passivation; titanium alloys; Al2O3-TiO2; AlAs; AlGaAs; GaAs-Ge; accumulation capacitance; annealing; atomic layer deposition; breakdown voltage; buffer layer; dielectric quality; epi-GaAs layer; epitaxial gallium arsenide metal-oxide-semiconductor capacitor; flatband voltage; frequency dispersion; gate dielectric; interface state density; leakage current; surface passivation; temperature 500 degC; temperature 675 degC; Buffer layers; Dielectrics; Gallium arsenide; Logic gates; Rough surfaces; Substrates; Surface roughness; Atomic layer deposition (ALD); TiAlO alloy high-$kappa$ dielectric; epitaxial gallium–arsenide (epi-GaAs) MOS;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2012.2226243
  • Filename
    6353908