DocumentCode :
692610
Title :
Simple and accurate capacitance modeling of 32nm multi-fin FinFET
Author :
Donghu Kim ; Yesung Kang ; Myunghwan Ryu ; Youngmin Kim
Author_Institution :
Sch. of Electr. & Comput. Eng., Ulsan Nat. Inst. of Sci. & Technol., Ulsan, South Korea
fYear :
2013
fDate :
17-19 Nov. 2013
Firstpage :
392
Lastpage :
393
Abstract :
In this paper, we investigate capacitive effect of multi-fins FinFET using the TCAD simulations. The analysis of the capacitance change is performed for the fin pitch and height variation in 32nm single gate FinFET. The analysis results show, as expected, that the increasing fin pitch (Pfin) variation leads to decrease in the coupling capacitance. And increasing height of the fin (Hfin) leads to increase in the capacitive coupling and total gate capacitances. Simple and accurate coupling capacitance models for both pitch and height variations of the three fins FinFET are proposed and verified with TCAD results.
Keywords :
MOSFET; electronic engineering computing; technology CAD (electronics); TCAD simulations; coupling capacitance models; fin pitch; height variation; multifins FinFET; pitch variations; single gate FinFET; size 32 nm; total gate capacitances; Capacitance; Couplings; FinFETs; Immune system; Logic gates; Radio frequency; Solid modeling; Multi-fins FinFET; coupling capacitance; fin height; fin pith; single-gate FinFET; variation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SoC Design Conference (ISOCC), 2013 International
Conference_Location :
Busan
Type :
conf
DOI :
10.1109/ISOCC.2013.6864059
Filename :
6864059
Link To Document :
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