Title : 
Simple and accurate capacitance modeling of 32nm multi-fin FinFET
         
        
            Author : 
Donghu Kim ; Yesung Kang ; Myunghwan Ryu ; Youngmin Kim
         
        
            Author_Institution : 
Sch. of Electr. & Comput. Eng., Ulsan Nat. Inst. of Sci. & Technol., Ulsan, South Korea
         
        
        
        
        
        
            Abstract : 
In this paper, we investigate capacitive effect of multi-fins FinFET using the TCAD simulations. The analysis of the capacitance change is performed for the fin pitch and height variation in 32nm single gate FinFET. The analysis results show, as expected, that the increasing fin pitch (Pfin) variation leads to decrease in the coupling capacitance. And increasing height of the fin (Hfin) leads to increase in the capacitive coupling and total gate capacitances. Simple and accurate coupling capacitance models for both pitch and height variations of the three fins FinFET are proposed and verified with TCAD results.
         
        
            Keywords : 
MOSFET; electronic engineering computing; technology CAD (electronics); TCAD simulations; coupling capacitance models; fin pitch; height variation; multifins FinFET; pitch variations; single gate FinFET; size 32 nm; total gate capacitances; Capacitance; Couplings; FinFETs; Immune system; Logic gates; Radio frequency; Solid modeling; Multi-fins FinFET; coupling capacitance; fin height; fin pith; single-gate FinFET; variation;
         
        
        
        
            Conference_Titel : 
SoC Design Conference (ISOCC), 2013 International
         
        
            Conference_Location : 
Busan
         
        
        
            DOI : 
10.1109/ISOCC.2013.6864059