Title :
Learn Multiple-Kernel SVMs for Domain Adaptation in Hyperspectral Data
Author :
Zhuo Sun ; Cheng Wang ; Hanyun Wang ; Li, Jie
Author_Institution :
Sch. of Inf. Sci. & Eng., Xiamen Univ., Xiamen, China
Abstract :
This letter presents a novel semisupervised method for addressing a domain adaptation problem in the classification of hyperspectral data. To overcome the influence of distribution bias between the source and target domains, we introduce the domain transfer multiple-kernel learning to simultaneously minimize the maximum mean discrepancy criterion and the structural risk functional of support vector machines. Then, the pairwise binary classifiers are merged as the multiclass classifier for solving the classification problem in hyperspectral data. Both bias and nonbias sampling strategies are introduced to evaluate the robustness of the proposed method against the spectral distribution bias. The results obtained from real data sets show that the proposed method can achieve higher classification accuracy even with cross-domain distribution bias and provide robust solutions with different labeled and unlabeled data sizes.
Keywords :
geophysical image processing; geophysical techniques; hyperspectral imaging; image classification; image sampling; support vector machines; classification accuracy; cross-domain distribution bias; distribution bias; domain adaptation; domain adaptation problem; domain transfer multiple-kernel learning; hyperspectral data; hyperspectral data classification; maximum mean discrepancy criterion; multiple-kernel SVM; robust solutions; semisupervised method; source domains; spectral distribution bias; structural risk functional; support vector machines; target domains; unlabeled data sizes; Accuracy; Hyperspectral imaging; Kernel; Support vector machines; Training; Domain adaptation (DA); hyperspectral image classification; maximum mean discrepancy (MMD); remote sensing; sample selection bias; support vector machines (SVMs);
Journal_Title :
Geoscience and Remote Sensing Letters, IEEE
DOI :
10.1109/LGRS.2012.2236818