• DocumentCode
    692868
  • Title

    Feng Shui of supercomputer memory positional effects in DRAM and SRAM faults

  • Author

    Sridharan, Vilas ; Stearley, Jon ; DeBardeleben, Nathan ; Blanchard, Sean ; Gurumurthi, Sudhanva

  • Author_Institution
    Adv. Micro Devices, Inc., Boxborough, MA, USA
  • fYear
    2013
  • fDate
    17-22 Nov. 2013
  • Firstpage
    1
  • Lastpage
    11
  • Abstract
    Several recent publications confirm that faults are common in high-performance computing systems. Therefore, further attention to the faults experienced by such computing systems is warranted. In this paper, we present a study of DRAM and SRAM faults in large high-performance computing systems. Our goal is to understand the factors that influence faults in production settings. We examine the impact of aging on DRAM, finding a marked shift from permanent to transient faults in the first two years of DRAM lifetime. We examine the impact of DRAM vendor, finding that fault rates vary by more than 4x among vendors. We examine the physical location of faults in a DRAM device and in a data center; contrary to prior studies, we find no correlations with either. Finally, we study the impact of altitude and rack placement on SRAM faults, finding that, as expected, altitude has a substantial impact on SRAM faults, and that top of rack placement correlates with 20% higher fault rate.
  • Keywords
    DRAM chips; SRAM chips; fault diagnosis; mainframes; parallel machines; parallel processing; DRAM device; DRAM faults; DRAM lifetime; DRAM vendor; Feng Shui; SRAM faults; data center; high-performance computing systems; physical fault location; positional effects; supercomputer memory; transient faults; Abstracts; Energy measurement; Laboratories; Random access memory; Terminology; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Performance Computing, Networking, Storage and Analysis (SC), 2013 International Conference for
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4503-2378-9
  • Type

    conf

  • Filename
    6877455