DocumentCode
692884
Title
ACIC: Automatic cloud I/O configurator for HPC applications
Author
Mingliang Liu ; Ye Jin ; Jidong Zhai ; Yan Zhai ; Qianqian Shi ; Xiaosong Ma ; Wenguang Chen
Author_Institution
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
fYear
2013
fDate
17-22 Nov. 2013
Firstpage
1
Lastpage
12
Abstract
The cloud has become a promising alternative to traditional HPC centers or in-house clusters. This new environment highlights the I/O bottleneck problem, typically with top-of-the-line compute instances but sub-par communication and I/O facilities. It has been observed that changing cloud I/O system configurations leads to significant variation in the performance and cost efficiency of I/O intensive HPC applications. However, storage system configuration is tedious and error-prone to do manually, even for experts. This paper proposes ACIC, which takes a given application running on a given cloud platform, and automatically searches for optimized I/O system configurations. ACIC utilizes machine learning models to perform black-box performance/cost predictions. To tackle the high-dimensional parameter exploration space unique to cloud platforms, we enable affordable, reusable, and incremental training guided by Plackett and Burman Matrices. Results with four representative applications indicate that ACIC consistently identifies near-optimal configurations among a large group of candidate settings.
Keywords
cloud computing; input-output programs; learning (artificial intelligence); parallel processing; ACIC; HPC applications; automatic cloud I/O configurator; cloud platform; high-dimensional parameter exploration space; machine learning models; optimized I/O system configurations; Benchmark testing; Cloud computing; Predictive models; Servers; Space exploration; Training; Training data; Cloud Computing; Modeling; Performance; Storage;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Computing, Networking, Storage and Analysis (SC), 2013 International Conference for
Conference_Location
Denver, CO
Print_ISBN
978-1-4503-2378-9
Type
conf
DOI
10.1145/2503210.2503216
Filename
6877471
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