Title :
Swendsen-Wang multi-cluster algorithm for the 2D/3D Ising model on Xeon Phi and GPU
Author :
Wende, Florian ; Steinke, Thomas
Author_Institution :
Zuse Inst. Berlin, Berlin-Dahlem, Germany
Abstract :
Simulations of the critical Ising model by means of local update algorithms suffer from critical slowing down. One way to partially compensate for the influence of this phenomenon on the runtime of simulations is using increasingly faster and parallel computer hardware. Another approach is using algorithms that do not suffer from critical slowing down, such as cluster algorithms. This paper reports on the Swendsen-Wang multi-cluster algorithm on Intel Xeon Phi coprocessor 5110P, Nvidia Tesla M2090 GPU, and x86 multi-core CPU.We present shared memory versions of the said algorithm for the simulation of the two- and three-dimensional Ising model. We use a combination of local cluster search and global label reduction by means of atomic hardware primitives. Further, we describe an MPI version of the algorithm on Xeon Phi and CPU, respectively. Significant performance improvements over known implementations of the Swendsen-Wang algorithm are demonstrated.
Keywords :
Ising model; application program interfaces; graphics processing units; message passing; parallel algorithms; shared memory systems; 2D-3D Ising model; GPU; Intel Xeon Phi coprocessor 5110P; MPI version; Nvidia Tesla M2090 GPU; Swendsen-Wang multicluster algorithm; atomic hardware primitives; global label reduction; local cluster search; local update algorithms; parallel computer hardware; shared memory versions; three-dimensional Ising model; two-dimensional Ising model; x86 multicore CPU; Clustering algorithms; Computational modeling; Computers; Graphics processing units; Instruction sets; Lattices; Solid modeling; CUDA; GPGPU; Ising model; Many-core processors; Swendsen-Wang multi-cluster algorithm; Xeon Phi; graph algorithms; performance evaluation;
Conference_Titel :
High Performance Computing, Networking, Storage and Analysis (SC), 2013 International Conference for
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4503-2378-9
DOI :
10.1145/2503210.2503254