Title :
High performance hybrid NoCs design with wireless/RF-I
Author :
Xiao Chunhua ; Huang Zhangqin ; Li Da
Author_Institution :
Embedded Software & Syst. Instn., Beijing Univ. of Technol., Beijing, China
Abstract :
According to the International Technology Roadmap for Semiconductors (ITRS), improving characteristics of metal wires will no longer satisfy performance requirements for future large scale MPSoC systems, and new interconnect paradigms are needed. Different revolutionary approaches like optical interconnect, Radio Frequency Interconnect (or RF-I), wireless interconnects with CMOS ultra wide band (UWB) technology have been explored. The hybrid hierarchical architecture with Wireless/RF-I backbones is more cost-efficiency and feasible due to the advantages in CMOS compatibility compared with other alternative interconnects, and has become one of the mainstreams of CMP architectures. However, how to design an efficient HNoCs is a new challenge. This work provides the architecture design flow of the HNoCs with wireless/RF-I, and explores the key problems in the architecture design from the perspectives of topology, resource management strategy and routing problems, which are different with traditional metallic interconnections.
Keywords :
CMOS integrated circuits; integrated circuit design; network-on-chip; optical interconnections; radiofrequency interconnections; ultra wideband technology; CMOS UWB technology; CMOS compatibility; CMOS ultra wide band technology; CMP architectures; HNoC design; ITRS; International Technology Roadmap for Semiconductors; MPSoC systems; RF-I backbone; architecture design flow; high performance hybrid NoCs design; hybrid hierarchical architecture; metal wires; optical interconnect; radio frequency interconnect; resource management strategy; routing problems; topology; wireless backbone; wireless interconnects; Computer architecture; Integrated circuit interconnections; Network-on-chip; Routing; Topology; Wireless communication; Chip Multiprocessors; On-chip interconnections; Radio Frequency Interconnect; wireless interconnect;
Conference_Titel :
Mechatronic Sciences, Electric Engineering and Computer (MEC), Proceedings 2013 International Conference on
Conference_Location :
Shengyang
Print_ISBN :
978-1-4799-2564-3
DOI :
10.1109/MEC.2013.6885441