DocumentCode
693056
Title
The finite element analysis on the stress field of contacts for electrical connectors
Author
Luo Yanyan ; Liu Xinwei ; Wang Yijun ; Liu Lei ; Ma Zhenping ; Zheng Shumei ; Wang Zhen
Author_Institution
Province-Minist. Joint Key Lab. of Electromagn. Field & Electr. Apparatus Reliability, Hebei Univ. of Technol., Tianjin, China
fYear
2013
fDate
20-22 Dec. 2013
Firstpage
3317
Lastpage
3320
Abstract
In this paper, the distribution of stress field of contacts for electrical connectors was studied. The finite element analysis models were established based on the structural-thermal analysis of them. With the consideration to the interference fit of the contacts in service, the three-dimensional solid model was imposed by the reasonable loads and boundary conditions and analyzed by ANSYS contact analysis module. The numerical analysis was made on the stress field of contacts for a certain type of electrical connectors at different ambient temperatures; and the results were analyzed. It can be seen that as the ambient temperature increases, the maximum Von Mises stress and the maximum deformation of the jack increases. The Von Mises Stress of jack is roughly divided into three parts. The maximum stress appears at about the contact surface near the bottom of slit which is probably the weakest point.
Keywords
crack-edge stress field analysis; electric connectors; electrical contacts; finite element analysis; thermal analysis; ANSYS contact analysis module; Von Mises stress; ambient temperatures; boundary conditions; contact surface; electrical connectors; finite element analysis models; interference fit; maximum deformation; reasonable loads; stress field distribution; structural-thermal analysis; three-dimensional solid model; Connectors; Contacts; Finite element analysis; Lifting equipment; Solid modeling; Strain; Stress; ANSYS; contact pressure; electrical connectors; finite element models; stress field;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronic Sciences, Electric Engineering and Computer (MEC), Proceedings 2013 International Conference on
Conference_Location
Shengyang
Print_ISBN
978-1-4799-2564-3
Type
conf
DOI
10.1109/MEC.2013.6885589
Filename
6885589
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