DocumentCode
693374
Title
Effect of low negative bias on electrical properties of nitrogen doped amorphous carbon thin films using bias-assisted pyrolysis-CVD
Author
Ishak, A. ; Rusop, M.
Author_Institution
NANO - Electron. Centre (NET), Univ. Teknol. MARA (UiTM), Kota Samarahan, Malaysia
fYear
2013
fDate
4-5 Dec. 2013
Firstpage
1
Lastpage
6
Abstract
Amorphous carbon thin films were deposited on glass substrates by using low negative bias voltage in the range of -10V to -50V at 500°C in 1 hour deposition. The effect of low negative bias voltage on electrical properties of nitrogen doped amorphous carbon thin films were determined. The amorphous carbon thin films were characterized by current-voltage measurement, and atomic force microscopy. Various responds of ohmic contacts were found from all samples due to different resistance value. The resistivity values of a-C thin films from 0V to -50V were 4.974×107 Ωcm, 1.569×103 Ωcm, 3.21×102 Ωcm, 0.11×102 Ωcm, and 1.845×104 Ωcm respectively. It has seen that, doping with nitrogen in low negative bias voltage can modify the electrical properties where conductivity and photo response were increased compared without nitrogen doped and the optimum bias is found at -40V.
Keywords
amorphous state; atomic force microscopy; carbon; chemical vapour deposition; contact resistance; doping; electrical resistivity; nitrogen; ohmic contacts; photoconductivity; pyrolysis; thin films; C; SiO2; atomic force microscopy; bias-assisted pyrolysis-CVD; chemical vapor deposition; current-voltage measurement; electrical conductivity; electrical properties; electrical resistivity; glass substrates; low negative bias voltage; nitrogen doped amorphous carbon thin films; ohmic contacts; photo conductivity; resistance value; resistivity 11 ohmcm to 49700000 ohmcm; time 1 hour; voltage 0 V to -50 V; Carbon; Conductivity; Films; Nitrogen; Rough surfaces; Substrates; Surface treatment; Amorphous carbon; DC bias; Negative bias; pyrolysis-CVD;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical, Electronics and System Engineering (ICEESE), 2013 International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4799-3177-4
Type
conf
DOI
10.1109/ICEESE.2013.6895032
Filename
6895032
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