DocumentCode :
693829
Title :
Unified Padring Design Flow - New Developments and Results
Author :
Ang Boon Chong ; Ho Kah Chun
Author_Institution :
Design Service, PMC-Sierra, Minden, Malaysia
fYear :
2013
fDate :
3-5 Dec. 2013
Firstpage :
462
Lastpage :
466
Abstract :
In the early design phase, padring design is one of the critical elements in design planning. The result from padring design not only will impact packaging, board level design, power integrity and signal integrity result, but also the overall product cost. In the past, padring design is often done through separate standalone tool like Orbit IO or internal excel estimation spreadsheet. The intend of this paper is to share the unified padring design methodology where single design database is referenced hence padring design will always be in sync with full chip backend database. Unified padring flow allows consistent cross functional review reference point as well as better controllability for core and padring design integration. Hopefully the methodology proposed will benefit the padring designers in floor planning and product cost estimation through unified padring flow.
Keywords :
costing; electronic engineering computing; integrated circuit design; packaging; Orbit IO; board level design; chip backend database; design database; design planning; floor planning; internal excel estimation spreadsheet; packaging; pad ring design integration; pad ring designers; power integrity; product cost estimation; signal integrity; unified pad ring design flow; Chip scale packaging; Databases; Optimization; Packaging; Planning; Routing; Synchronization; ASIC Padring Design; Padring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Artificial Intelligence, Modelling and Simulation (AIMS), 2013 1st International Conference on
Conference_Location :
Kota Kinabalu
Print_ISBN :
978-1-4799-3250-4
Type :
conf
DOI :
10.1109/AIMS.2013.84
Filename :
6959962
Link To Document :
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