• DocumentCode
    694210
  • Title

    Total productive maintenance strategy in a semiconductor manufacturer: A case study

  • Author

    Ng, K.C. ; Chong, Katie E. ; Goh, G.G.G.

  • Author_Institution
    Infineon Technol., Batu Berendam, Malaysia
  • fYear
    2013
  • fDate
    10-13 Dec. 2013
  • Firstpage
    1184
  • Lastpage
    1188
  • Abstract
    The role of maintenance in manufacturing has become more crucial and important in today´s competitive environment. It is estimated that maintenance cost contributed approximately 10-30 percent of total operation cost. In order to stay competitive, manufacturing companies are forced to introduce production improvement programs to increase both quality and productivity. Total productive maintenance (TPM) is a well-known and very useful methodology which allows manufacturing firms to attain near ideal conditions with zero downtime, zero defects and zero accident. The objective of this paper is to study the effectiveness of TPM implementation in a multinational semiconductor manufacturer. In this study a bottleneck process from the production line was chosen and continuous improvements were implemented to improve equipment effectiveness. The results achieved are very encouraging in the reduction of equipment downtime, improvement in overall equipment effectiveness, employee motivation and reduction in number of accidence rate at the shop-floor.
  • Keywords
    costing; maintenance engineering; productivity; semiconductor industry; strategic planning; employee motivation; maintenance; maintenance cost; manufacturing companies; manufacturing firms; multinational semiconductor manufacturer; operation cost; semiconductor manufacturer; total productive maintenance strategy; Companies; Maintenance engineering; Manufacturing; Productivity; Semiconductor device measurement; Kobetsu Kaizan; OEE; Semiconductor industry; Total productive maintenance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IEEM), 2013 IEEE International Conference on
  • Conference_Location
    Bangkok
  • Type

    conf

  • DOI
    10.1109/IEEM.2013.6962598
  • Filename
    6962598