DocumentCode
69447
Title
RF Power Absorption Enhancement by Optimization of the Conductive Grid in a Magnetic Composite
Author
Baekil Nam ; Jinu Kim ; Joonsik Lee ; Ki Hyeon Kim
Author_Institution
Dept. of Phys., Yeungnam Univ., Gyeongsan, South Korea
Volume
50
Issue
11
fYear
2014
fDate
Nov. 2014
Firstpage
1
Lastpage
3
Abstract
Electromagnetic noise suppression was studied by near-field power absorption of a magnetic composite film composed of magnetic fillers and metallic mesh grid in nonmagnetic matrix, which were simulated using a commercial finite-element electromagnetic solver. The geometrical characteristics of the grid on the power absorption were evaluated using the transmission line method with a microstrip line. For conductive grid spacing and the period of lines composing a grid, maximum power absorption was obtained when the width of microstrip signal line was comparable with the grid spacing. The vertical position of the grid in magnetic composite was suggested to be at the center or top position of the composite for higher power absorption. The power absorptions and bandwidth of frequency were enhanced using thin metallic grid on magnetic composite in comparison with that of thick metallic grid.
Keywords
composite materials; electromagnetic wave absorption; finite element analysis; interference suppression; magnetic thin films; microstrip lines; transmission lines; RF power absorption enhancement; commercial finite-element electromagnetic solver; conductive grid optimization; conductive grid spacing; electromagnetic noise suppression; geometrical characteristics; magnetic composite; magnetic composite film; magnetic fillers; metallic mesh grid; microstrip signal line width; near-field power absorption; nonmagnetic matrix; thick metallic grid; transmission line method; Absorption; Electromagnetic interference; Magnetic noise; Magnetic resonance; Magnetic shielding; Microstrip; Soft magnetic materials; Conductive grid; magnetic composite; microstrip line; power absorption;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/TMAG.2014.2323433
Filename
6971450
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