Title :
Finite Element Analysis on Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Using Different Shearing Height
Author :
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Ong Tee Say ; Ehkan, P.
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Pauh Putra Perlis, Malaysia
Abstract :
Enhancing the reliability Ball grid array (BGA) is significant due major contribution as an interconnection in the electronic devices. Due to the compactness of the electronic devices, ball grid array (BGA) interconnection methods are utilized as passage to transmit power and signals within the electronic. However, the reliability of the BGA is very significant as it has a direct effect on the performance of the device. Ball shear test are utilized to evaluate the reliability and adhesion strength of the solder ball. Therefore, in this work, shear test on solder joint of Ball Grid Array (BGA) was with varied shear height were simulated. Ansys version 11 was utilized for the simulation. The reliability two types of solder ball material, Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu were compared. The simulation result showed that shear ram height has significant influence on the outcome of the shear test. The Sn-3.5Ag-0.7Cu solder ball exhibited higher stress when compared Sn-3.9Ag-0.6Cu solder ball.
Keywords :
ball grid arrays; circuit simulation; digital simulation; electronic engineering computing; finite element analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; solders; Ansys version 11; BGA interconnection methods; SnAgCu; adhesion strength; ball grid array; ball shear test; device performance; electronic devices compactness; finite element analysis; power transmission; reliability; shear ram height; shearing height; solder ball material; solder joint; Computational modeling; Electronics packaging; Materials; Random access memory; Reliability; Soldering; Stress; Ball Grid Array (BGA); shear test; single solder joint;
Conference_Titel :
Modelling and Simulation (EUROSIM), 2013 8th EUROSIM Congress on
Conference_Location :
Cardiff
DOI :
10.1109/EUROSIM.2013.44
