DocumentCode :
70214
Title :
An STM-16 Frame Termination VLSI With 2.5-Gb/s/Pin Input/Output Buffers: High-Speed and Low-Power Multi- math\\rm{V}_{\\rm DD} CMOS/SIMOX Techniques
Author :
Shibata, Nobutaro ; Ohtomo, Yusuke ; Nishisaka, Mika ; Sato, Yasuhiro
Author_Institution :
NTT Microsyst. Integration Labs., Atsugi, Japan
Volume :
23
Issue :
6
fYear :
2015
fDate :
Jun-15
Firstpage :
1089
Lastpage :
1102
Abstract :
Many of the current wireline networks are digitalized. In Japan, a synchronous digital hierarchy (SDH) system is installed in the public switched telephone network, and application data are transferred with a synchronous transfer module (STM). This paper presents an STM-16 frame termination VLSI fabricated with a 0.3-μm quintuple-metal CMOS/SIMOX process. To reduce power consumption, we employ a multiVDD architecture using 2- and 1-V power supplies. Also, fully depleted silicon on insulator (FD-SOI) devices are used to obtain a higher operating speed and to reduce dynamic power dissipation. To install another powerline in every standard cell without increasing the cell size, a stacked multiple powerlines scheme is proposed. In addition, some dedicated standard cells are developed to convert the logical high level without degrading the signal integrity. With regards to hard macros, 2-V MUX/DEMUX macros achieve a high operating speed of 2.5 Gb/s, while a dual-port SRAM macro can operate at a low supply voltage of 1 V. Moreover, 2-V 50-Ω-terminated input/output buffers using a new direct-drive amplifier operate without dedicated power supplies. With our STM-16 frame termination VLSI, the power consumption during the standby is 34 mW, and that for 2.5-Gb/s operation is 1.2 W at 25 °C.
Keywords :
CMOS integrated circuits; SIMOX; SRAM chips; VLSI; amplifiers; buffer circuits; cooling; low-power electronics; power cables; power supply circuits; synchronous digital hierarchy; FD-SOI; Japan; MUX-DEMUX macros; STM-16 frame termination VLSI; Si; bit rate 2.5 Gbit/s; direct-drive amplifier; dual-port SRAM macro; dynamic power dissipation; fully depleted silicon on insulator; high-speed CMOS-SIMOX; low-power multiVDD CMOS-SIMOX; pin input-output buffers; power 1.2 W; power 34 mW; power consumption; power supplies; public switched telephone network; quintuple-metal CMOS-SIMOX process; resistance 50 ohm; signal integrity; size 0.3 mum; stacked multiple powerlines; synchronous digital hierarchy; synchronous transfer module; temperature 25 degC; voltage 1 V; voltage 2 V; wireline networks; CMOS integrated circuits; Computer architecture; Logic gates; Microprocessors; Power supplies; Standards; Very large scale integration; CMOS; FD-SOI; SDH system; SIMOX; STM-16; high speed; low power; multi- $V_{rm DD}$; multi-VDD;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2014.2333589
Filename :
6898847
Link To Document :
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