DocumentCode
702311
Title
Recovery of faulty TSVs in 3D ICs
Author
Roy, Surajit Kumar ; Roy, Kaustav ; Giri, Chandan ; Rahaman, Hafizur
Author_Institution
Dept. of Inf. Technol., Indian Inst. of Eng. Sci. & Technol., Shibpur, India
fYear
2015
fDate
2-4 March 2015
Firstpage
533
Lastpage
536
Abstract
Through-silicon-via (TSV) based three dimensional (3D) integration has evolved as a great area in integrated-circuit (IC) technology. TSV defects may happen due to manufacturing problem 3D IC and the chip is discarded for a single TSV defect. Allocation of redundant TSVs to the faulty TSVs is an attractive solution to recover from TSV defects. Proper grouping of functional and redundant TSVs can enhance the recovery of faulty TSVs. In this paper we have addressed a heuristic approach to find the best possible grouping of functional and redundant TSVs such that the wire length for rerouting redundant TSV is minimized.
Keywords
fault diagnosis; integrated circuit interconnections; network routing; three-dimensional integrated circuits; 3D IC; 3D integrated circuit technology; TSV; heuristic approach; through-silicon-via; Circuit faults; Maintenance engineering; Redundancy; Three-dimensional displays; Through-silicon vias; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2015 16th International Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
978-1-4799-7580-8
Type
conf
DOI
10.1109/ISQED.2015.7085482
Filename
7085482
Link To Document