DocumentCode
702315
Title
A novel physical failure analysis of MEMS motion sensor for interface inspection
Author
Chun-An Huang ; Li Chuang ; Kim Hsu ; Chung, Steel ; Chan, Tim
Author_Institution
Integrated Service Technol. Inc., Hsinchu, Taiwan
fYear
2015
fDate
2-4 March 2015
Firstpage
561
Lastpage
564
Abstract
This paper demonstrates a novel physical failure analysis (PFA) solution of MEMS motion sensor to inspect the fusion bonding interface between MEMS motion sensor proof-mass and oxide layer to locate defect points. This analytical study shows successful etching solution removal of MEMS motion sensor proof-mass and inspection of defect points.
Keywords
bonding processes; etching; inspection; microsensors; motion measurement; sensor fusion; MEMS motion sensor; PFA; etching solution removal; fusion bonding interface; interface inspection; oxide layer; physical failure analysis; Bonding; Etching; Failure analysis; Inspection; Integrated circuits; Micromechanical devices; Substrates; Fusion Bonding; MEMS; PFA; Proof-Mass;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2015 16th International Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
978-1-4799-7580-8
Type
conf
DOI
10.1109/ISQED.2015.7085488
Filename
7085488
Link To Document