DocumentCode :
702315
Title :
A novel physical failure analysis of MEMS motion sensor for interface inspection
Author :
Chun-An Huang ; Li Chuang ; Kim Hsu ; Chung, Steel ; Chan, Tim
Author_Institution :
Integrated Service Technol. Inc., Hsinchu, Taiwan
fYear :
2015
fDate :
2-4 March 2015
Firstpage :
561
Lastpage :
564
Abstract :
This paper demonstrates a novel physical failure analysis (PFA) solution of MEMS motion sensor to inspect the fusion bonding interface between MEMS motion sensor proof-mass and oxide layer to locate defect points. This analytical study shows successful etching solution removal of MEMS motion sensor proof-mass and inspection of defect points.
Keywords :
bonding processes; etching; inspection; microsensors; motion measurement; sensor fusion; MEMS motion sensor; PFA; etching solution removal; fusion bonding interface; interface inspection; oxide layer; physical failure analysis; Bonding; Etching; Failure analysis; Inspection; Integrated circuits; Micromechanical devices; Substrates; Fusion Bonding; MEMS; PFA; Proof-Mass;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design (ISQED), 2015 16th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4799-7580-8
Type :
conf
DOI :
10.1109/ISQED.2015.7085488
Filename :
7085488
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=702315
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