DocumentCode :
702320
Title :
Technology/circuit co-optimization and benchmarking for graphene interconnects at Sub-10nm technology node
Author :
Chenyun Pan ; Raghavan, Praveen ; Catthoor, Francky ; Tokei, Zsolt ; Naeemi, Azad
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2015
fDate :
2-4 March 2015
Firstpage :
599
Lastpage :
603
Abstract :
In this paper, graphene interconnects are analyzed based on realistic circuits in terms of multiple material properties, such as the mean free path, the contact resistance, and the edge roughness. The benchmark against conventional copper wires shows that the advantage of graphene usage occurs only under certain circumstances. The device-level parameters, including the supply and threshold voltages, and the circuit-level parameters, including the wire length and width, have large impacts on both the delay and energy-delay product (EDP) comparisons. Two representative circuits, a 32-bit adder and an SRAM, are investigated. Up to 40% and 70% of the improvement in delay and EDP are observed for a 32-bit adder. For the SRAM application, contact resistance is a crucial factor in dictating the performance of graphene interconnects.
Keywords :
SRAM chips; adders; circuit optimisation; contact resistance; copper; graphene devices; integrated circuit interconnections; SRAM; adder; circuit cooptimization; circuit-level parameters; contact resistance; copper wires; device-level parameters; energy-delay product; graphene interconnects; storage capacity 32 bit; threshold voltages; wire length; wire width; Capacitance; Copper; Delays; Graphene; Integrated circuit interconnections; Resistance; Wires; 32-bit adder; Multi-layer graphene interconnect; SRAM; circuit-level simulation; delay; energy-delay product; performance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design (ISQED), 2015 16th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4799-7580-8
Type :
conf
DOI :
10.1109/ISQED.2015.7085495
Filename :
7085495
Link To Document :
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