Title :
Critical Current Density and Temperature Dependence of Nb-Al Oxide-Nb Junction Resistance and Implications for Room Temperature Characterization
Author :
Kleinsasser, A. ; Chui, T. ; Bumble, B. ; Ladizinsky, E.
Author_Institution :
Caltech Jet Propulsion Lab., Pasadena, CA, USA
Abstract :
Room temperature junction resistance measurements are commonly used for screening Josephson-based circuits because testing is much easier than at cryogenic temperatures and can even be carried out at the wafer level. The value of ambient testing depends on the existence of a strong correspondence between the measured resistance at room temperature and the resistance and critical current obtained at the ultimate operating temperature. We have systematically studied the temperature dependence of junction resistance in order to quantify the emergence, with increasing critical current density, of parasitic contributions from non-uniform currents flowing in the Nb films, which tend to limit the value of room temperature screening. We will describe our measurements and our approach to correcting for these parasitic effects.
Keywords :
aluminium; aluminium compounds; critical current density (superconductivity); electric resistance; metallic thin films; niobium; superconducting materials; superconducting thin films; superconductor-normal-superconductor devices; Josephson-based circuits; Nb films; Nb-Al oxide-Nb junction resistance; Nb-Al-AlOx-Nb; ambient testing; critical current density; cryogenic temperatures; junction resistance measurements; nonuniform currents; parasitic contributions; parasitic effects; temperature 293 K to 298 K; temperature dependence; ultimate operating temperature; wafer level; Electrical resistance measurement; Films; Josephson junctions; Junctions; Niobium; Resistance; Temperature measurement; Josephson junctions; superconducting devices; superconducting integrated circuits; superconducting thin films;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2012.2228731