DocumentCode :
704004
Title :
Thermal aware design method for VCSEL-based on-chip optical interconnect
Author :
Hui Li ; Fourmigue, Alain ; Le Beux, Sebastien ; Letartre, Xavier ; O´Connor, Ian ; Nicolescu, Gabriela
Author_Institution :
Lyon Inst. of Nanotechnol., Ecole Centrale de Lyon, Ecully, France
fYear :
2015
fDate :
9-13 March 2015
Firstpage :
1120
Lastpage :
1125
Abstract :
Optical Network-on-Chip (ONoC) is an emerging technology considered as one of the key solutions for future generation on-chip interconnects. However, silicon photonic devices in ONoC are highly sensitive to temperature variation, which leads to a lower efficiency of Vertical-Cavity Surface-Emitting Lasers (VCSELs), a resonant wavelength shift of Microring Resonators (MR), and results in a lower Signal to Noise Ratio (SNR). In this paper, we propose a methodology enabling thermal-aware design for optical interconnects relying on CMOS-compatible VCSEL. Thermal simulations allow designing ONoC interfaces with low gradient temperature and analytical models allow evaluating the SNR.
Keywords :
CMOS integrated circuits; integrated circuit interconnections; integrated optoelectronics; laser cavity resonators; laser noise; network-on-chip; optical interconnections; semiconductor lasers; surface emitting lasers; CMOS-compatible VCSEL; SNR; VCSEL-based on-chip optical interconnect; microring resonators; optical network-on-chip; resonant wavelength shift; signal-to-noise ratio; silicon photonic devices; thermal aware design method; thermal simulations; vertical-cavity surface-emitting lasers; Heating; Optical interconnections; Optical sensors; Optical waveguides; Signal to noise ratio; Vertical cavity surface emitting lasers; Waveguide lasers; ONoC; design methodology; thermal simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2015
Conference_Location :
Grenoble
Print_ISBN :
978-3-9815-3704-8
Type :
conf
Filename :
7092556
Link To Document :
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