• DocumentCode
    70413
  • Title

    Demonstration of a Hybrid Opto-Electronic Transmitter on SoI for Access Networks

  • Author

    Stamatiadis, Christos ; Mekonnen, Ketemaw A. ; Winzer, G. ; Voigt, K. ; Kreissl, Jochen ; Preve, Giovan B. ; Llopis, Merce ; Stampoulidis, L. ; Zimmermann, L. ; Petermann, K.

  • Author_Institution
    Joint Lab. Silicon Photonics HFT4, Tech. Univ. Berlin, Berlin, Germany
  • Volume
    26
  • Issue
    6
  • fYear
    2014
  • fDate
    15-Mar-14
  • Firstpage
    617
  • Lastpage
    620
  • Abstract
    We present a hybrid integrated transmitter comprised of an InP/InGaAsP electro-absorption modulated laser (EML) electrically driven by a BiCMOS SiGe electronic circuit on 4-μm SoI substrate. The EML includes an electro-absorption modulator integrated together with a distributed feedback laser and a spot-size expander. The modulator driver is fabricated using the SiGe BiCMOS approach with 2.5 Vp-p nominal output swing. Both elements have been flip-chip mounted on a thick SoI board using 14-μm gold-tin bumps and employing a high accuracy flip-chip bonder. The photonic chip has a footprint of 7 mm2 and consumes a power of 0.8 W. We test the device optically and electrically demonstrating error-free operation at 10 and 20 Gb/s.
  • Keywords
    BiCMOS integrated circuits; Ge-Si alloys; distributed feedback lasers; electro-optical modulation; electroabsorption; flip-chip devices; gallium arsenide; indium compounds; radio transmitters; silicon-on-insulator; subscriber loops; BiCMOS electronic circuit; EML; InP-InGaAsP; SiGe; SoI substrate; access networks; bit rate 10 Gbit/s; bit rate 20 Gbit/s; distributed feedback laser; electro-absorption modulated laser; flip-chip bonder; flip-chip mounted; gold-tin bumps; hybrid integrated transmitter; hybrid opto-electronic transmitter; modulator driver; photonic chip; power 0.8 W; size 14 mum; size 4 mum; spot-size expander; Flip-chip devices; Modulation; Optical transmitters; Optical waveguides; Silicon; Silicon germanium; Substrates; Hybrid photonic integration; fiber to the home (FTTH); optical access; opto-electronic devices; silicon-on-insulator;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2014.2301818
  • Filename
    6718064