DocumentCode :
70413
Title :
Demonstration of a Hybrid Opto-Electronic Transmitter on SoI for Access Networks
Author :
Stamatiadis, Christos ; Mekonnen, Ketemaw A. ; Winzer, G. ; Voigt, K. ; Kreissl, Jochen ; Preve, Giovan B. ; Llopis, Merce ; Stampoulidis, L. ; Zimmermann, L. ; Petermann, K.
Author_Institution :
Joint Lab. Silicon Photonics HFT4, Tech. Univ. Berlin, Berlin, Germany
Volume :
26
Issue :
6
fYear :
2014
fDate :
15-Mar-14
Firstpage :
617
Lastpage :
620
Abstract :
We present a hybrid integrated transmitter comprised of an InP/InGaAsP electro-absorption modulated laser (EML) electrically driven by a BiCMOS SiGe electronic circuit on 4-μm SoI substrate. The EML includes an electro-absorption modulator integrated together with a distributed feedback laser and a spot-size expander. The modulator driver is fabricated using the SiGe BiCMOS approach with 2.5 Vp-p nominal output swing. Both elements have been flip-chip mounted on a thick SoI board using 14-μm gold-tin bumps and employing a high accuracy flip-chip bonder. The photonic chip has a footprint of 7 mm2 and consumes a power of 0.8 W. We test the device optically and electrically demonstrating error-free operation at 10 and 20 Gb/s.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; distributed feedback lasers; electro-optical modulation; electroabsorption; flip-chip devices; gallium arsenide; indium compounds; radio transmitters; silicon-on-insulator; subscriber loops; BiCMOS electronic circuit; EML; InP-InGaAsP; SiGe; SoI substrate; access networks; bit rate 10 Gbit/s; bit rate 20 Gbit/s; distributed feedback laser; electro-absorption modulated laser; flip-chip bonder; flip-chip mounted; gold-tin bumps; hybrid integrated transmitter; hybrid opto-electronic transmitter; modulator driver; photonic chip; power 0.8 W; size 14 mum; size 4 mum; spot-size expander; Flip-chip devices; Modulation; Optical transmitters; Optical waveguides; Silicon; Silicon germanium; Substrates; Hybrid photonic integration; fiber to the home (FTTH); optical access; opto-electronic devices; silicon-on-insulator;
fLanguage :
English
Journal_Title :
Photonics Technology Letters, IEEE
Publisher :
ieee
ISSN :
1041-1135
Type :
jour
DOI :
10.1109/LPT.2014.2301818
Filename :
6718064
Link To Document :
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