• DocumentCode
    7043
  • Title

    Ka-Band Gap Waveguide Coupled-Resonator Filter for Radio Link Diplexer Application

  • Author

    Alos, E.A. ; Zaman, A.U. ; Kildal, P.

  • Author_Institution
    Dept. of Signals & Syst., Chalmers Univ. of Technol., Gothenburg, Sweden
  • Volume
    3
  • Issue
    5
  • fYear
    2013
  • fDate
    May-13
  • Firstpage
    870
  • Lastpage
    879
  • Abstract
    Gap waveguide technology represents an interesting alternative as low-loss, cost-effective, and high-performance transmission line and package of microwave and millimeter-wave systems. A Ka-band coupled-resonator filter for a radio link diplexer, which requires high selectivity to isolate transmit and receiving channels, is proposed and realized using gap waveguide technology. The band-pass filter, which has a central frequency of 37.37 GHz and a pass bandwidth of 560 MHz, is fabricated between two parallel metal plates, leaving an air gap between them. After milling one of the plates, silver-plating is applied on them. Measurements show a minimum in-band insertion loss of 1 dB and agree quite well with simulations.
  • Keywords
    UHF filters; band-pass filters; electronics packaging; electroplating; microwave filters; millimetre wave filters; multiplexing equipment; radio links; radio receivers; radio transmitters; resonator filters; waveguide couplers; wireless channels; Ka-band gap waveguide coupled-resonator filter; air gap; band-pass filter; bandwidth 560 MHz; frequency 37.37 GHz; loss 1 dB; microwave package system; millimeter-wave package system; minimum in-band insertion loss; parallel metal plate milling; radio link diplexer application; receiving channel isolation; silver-plating; transmission line; transmitting channel isolation; Band pass filters; Couplings; Metals; Nails; Rectangular waveguides; Resonant frequency; Waveguide discontinuities; Band pass filters; gap waveguides; microwave filters; millimeter-wave circuits; resonator filters;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2012.2231140
  • Filename
    6409513