Abstract :
The following topics are dealt with: semiconductor thermal measurement and management in harsh environments; modeling and characterization for integrated circuits; measurements and characterization of advanced materials; computational fluid dynamics analysis; heat transfer; quality and reliability.
Keywords :
computational fluid dynamics; heat measurement; heat transfer; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; thermal management (packaging); computational fluid dynamics; harsh environments; heat transfer; integrated circuit characterization; integrated circuit modeling; reliability; semiconductor thermal management; semiconductor thermal measurement;
Conference_Titel :
Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st
Conference_Location :
San Jose, CA
DOI :
10.1109/SEMI-THERM.2015.7100114
