Title :
Sensor placement for surface temperature control in thin mobile form factors
Author_Institution :
Intel Corp., Hillsboro, OR, USA
Abstract :
Thin mobile form factors are primarily passively cooled. Because the outer case is the main heat rejection area, total dissipation capability is limited by user perception of touch temperature. The platform dissipation can only temporarily exceed this limit and may need to be controlled. Internal sensors are inexpensive proxies for surface hot spots. This paper describes best practices for locating internal sensors to represent outer surface temperature.
Keywords :
cooling; sensor placement; temperature control; temperature sensors; passive cooling; sensor placement; surface temperature control; thin mobile form factors; Heating; Surface treatment; Temperature distribution; Temperature measurement; Temperature sensors;
Conference_Titel :
Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st
Conference_Location :
San Jose, CA
DOI :
10.1109/SEMI-THERM.2015.7100135
