DocumentCode :
707175
Title :
Influence of temperature control limits on passively cooled computing system performance
Author :
Carbone, Mark
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fYear :
2015
fDate :
15-19 March 2015
Firstpage :
41
Lastpage :
45
Abstract :
Passively-cooled electronic systems such as tablet computers and cell phones commonly are thermally limited by the allowable touch temperature of their surfaces. These systems typically cannot cool maximum processor power in steady state and simultaneously meet surface temperature restrictions. The primary surface temperature control method for thin mobile devices is to limit power, typically resulting in lower computing performance. Improved thermal designs allow higher power dissipation and therefore increased computing performance. Thermal and mechanical design engineers typically operate in terms of temperature for a given power, and this is not usually translated to computing performance. It can be difficult to justify a better thermal design if it is not quantified in its utility to the user. This paper quantifies the tradeoffs between thermal solution performance/temperature control limits and computing performance for two tablet computers and one cell phone that all use the same type of SoC processor.
Keywords :
cooling; performance evaluation; power aware computing; smart phones; system-on-chip; temperature control; SoC processor; cell phones; computing performance; maximum processor power; mechanical design engineers; passively cooled computing system performance; passively-cooled electronic systems; power dissipation; surface temperature control method; surface temperature restrictions; tablet computers; temperature control limits; thermal design engineers; thin mobile devices; touch temperature; Cooling; Heating; System performance; Temperature; Temperature sensors; SoC; System on a Chip; Tablet; computing performance; fanless design; fps; frame rate; frames per second; passive cooling; phone; power; temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Type :
conf
DOI :
10.1109/SEMI-THERM.2015.7100137
Filename :
7100137
Link To Document :
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