Application of the transient dual interface method in test based modeling of heat-sinks aimed at socketable LED modules

Author

Poppe, Andras ; Hantos, Gusztav ; Hegedus, Janos

Author_Institution

Budapest Univ. of Technol., Budapest, Hungary

fYear

2015

fDate

15-19 March 2015

Firstpage

261

Lastpage

266

Abstract

This paper presents a method of thermal characterization of heat-sinks aimed at cooling socketable LED modules. The suggested measurement procedure resembles the transient dual interface method of the JEDEC JESD51-14 standard: two transient measurements are performed with different qualities of the thermal interface of the heat-sink surface mating the LED modules. The structure functions section identified with such a measurement represents solely the measured heat-sink. Step wise approximation of the obtained structure function section is used to create DCTMs of the heat-sinks, aimed at fast system level simulations of LED modules.

Keywords

heat sinks; light emitting diodes; transients; JEDEC JESD51-14 standard; heat-sinks; socketable LED modules; step wise approximation; test based modeling; thermal interface; transient dual interface method; Light emitting diodes; Resistance heating; Semiconductor device measurement; Thermal resistance; Transient analysis; heat-sink compact modeling; socketable LED module; test based modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st

Conference_Location

San Jose, CA

ISSN

1065-2221

Type

conf

DOI

10.1109/SEMI-THERM.2015.7100170

Filename

7100170