DocumentCode :
707206
Title :
An efficient transient thermal model for electronics thermal management based on singular value decomposition
Author :
Xiao Hu ; Krishnaswamy, Sivasubramani ; Asgari, Saeed ; Stanton, Scott
Author_Institution :
ANSYS Inc., Canonsburg, PA, USA
fYear :
2015
fDate :
15-19 March 2015
Firstpage :
280
Lastpage :
286
Abstract :
Electronics thermal management for high power applications is crucial. Modeling is an indispensable tool to help engineers design better electronics cooling systems. An efficient transient thermal model for electronics thermal management based on singular value decomposition (SVD) is proposed. The model generation process starts with computation fluid dynamics (CFD) results of an electronics model, from which SVD is used to calculate the approximate subspace which temperature solution belongs to. Then a state space model is created based on the CFD and SVD results to calculate the temperature field in the subspace. The state space model is very efficient and runs orders of magnitude faster because the dimension of the subspace is small. The state space model is then shown to provide very similar results as those from CFD under arbitrary transient power dissipation.
Keywords :
computational fluid dynamics; cooling; electronic engineering computing; singular value decomposition; thermal analysis; thermal management (packaging); transient analysis; CFD; SVD; approximate subspace calculation; arbitrary transient power dissipation; computational fluid dynamics; electronics cooling system design; electronics thermal management; engineers; high power applications; model generation process; orders of magnitude; singular value decomposition; state space model; temperature field calculation; transient thermal model efficiency; Computational fluid dynamics; Computational modeling; Heating; Insulated gate bipolar transistors; Linear systems; Read only memory; Temperature distribution; CFD; LTI; ROM; SVD;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Type :
conf
DOI :
10.1109/SEMI-THERM.2015.7100173
Filename :
7100173
Link To Document :
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