DocumentCode :
708062
Title :
Applications of computational mechanics in stretchable electronics
Author :
Zhuangjian Liu
Author_Institution :
A*Star, Inst. of High Performance Comput., Singapore, Singapore
fYear :
2015
fDate :
19-22 April 2015
Firstpage :
1
Lastpage :
4
Abstract :
Stretchable electronics system is an emerging technology for next-generation electronics. These type of stretchable system can geometrically accommodate large mechanical deformations without imparting significant strains and stress in the materials themselves. Potential uses include flexible sensors, transmitters and new photovoltaic and medical devices. Computational mechanics studies reveal many of the key underlying aspects of these systems and can establish important design criteria concerning device failure. In this study, numerical simulations are used for investigations of materials and system designs for stretchable electronics, which have excellent mechanical flexibility and make them attractive for these systems. The results show that the new designs are possible to build high performance circuits that are not only bendable but are also, in some cases, reversibly stretchable. And it is a path to build the high performance silicon complementary metal oxide semiconductor that might be interesting for electronics. Furthermore it could optimize mechanics and materials for circuits that exhibit maximum stretchability.
Keywords :
deformation; flexible electronics; numerical analysis; semiconductor thin films; computational mechanics; device failure; flexible sensors; high performance circuits; high performance silicon complementary metal oxide semiconductor; large mechanical deformations; mechanical flexibility; medical devices; next-generation electronics; photovoltaic devices; stretchable electronics system; transmitters; Films; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
Type :
conf
DOI :
10.1109/EuroSimE.2015.7103087
Filename :
7103087
Link To Document :
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