Title :
A geometry-independent lifetime modelling method for aluminum heavy wire bond joints
Author :
Grams, Arian ; Hofer, Jan ; Middendorf, Andreas ; Schmitz, Stefan ; Wittler, Olaf ; Lang, Klaus-Dieter
Author_Institution :
Fraunhofer IZM, Berlin, Germany
Abstract :
Wire bond degradation is a limiting factor for the lifetime of state of the art power modules. So, there is a need for widely applicable and proven modelling techniques to achieve a reliable design. In this paper, a new crack growth law has been developed and calibrated with experimental data. By defining a failure criterion and optimizing model parameters, good lifetime predictions have been achieved. In addition, further possibilities to use this modelling approach have been proposed, e.g. damage in interconnect layers as sinter silver or solder layers could be considered.
Keywords :
aluminium alloys; integrated circuit bonding; integrated circuit interconnections; integrated circuit reliability; lead bonding; silver; solders; Ag; Al; aluminum heavy wire bond joints; crack growth law; failure criterion; geometry-independent lifetime modelling method; interconnect layers; lifetime predictions; silver layers; solder layers; wire bond degradation; Insulated gate bipolar transistors; MOSFET; Plastics; Semiconductor device modeling; Wires;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
DOI :
10.1109/EuroSimE.2015.7103091
