DocumentCode :
708067
Title :
Reliability analysis of copper bump interconnection in double-sided power module
Author :
Chia-Chi Tsai ; Li-Ling Liao ; Yen-Fu Su ; Tuan-Yu Hung ; Kuo-Ning Chiang
Author_Institution :
Adv. Microsyst. Packaging & Nano-Mech. Res. Lab., Hsinchu, Taiwan
fYear :
2015
fDate :
19-22 April 2015
Firstpage :
1
Lastpage :
4
Abstract :
A high current load may cause the Joule heating, subsequently raising the chip temperature in a conventional power module. Temperature excursion in power chip may generate thermal stress, induce failure and reduce its reliability. Double-sided power module is a crucial structure to provide another heat dissipation path and efficiently reduce chip temperature. This study estimate the thermal and reliability analysis of double-sided power module by using copper bump as an interconnection under different cooling condition. The connection layout can be designed more flexible by using bump interconnection in double-sided power module. The concept of dummy ball also utilized to reduce the mechanical strain or stress of copper bump and improve its reliability in a power module.
Keywords :
cooling; integrated circuit interconnections; integrated circuit reliability; power integrated circuits; thermal stresses; Joule heating; bump interconnection; chip temperature; chip temperature reduction; connection layout; conventional power module; cooling condition; copper bump; copper bump interconnection; current load; double-sided power module; dummy ball; failure; heat dissipation path; mechanical strain reduction; power chip; reliability analysis; stress reduction; temperature excursion; thermal estimation; thermal stress; Analytical models; Ceramics; Copper; Insulated gate bipolar transistors; Junctions; Nickel; Reliability; Double-sided power module; bump interconnection; finite element models; power cycling loading;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
Type :
conf
DOI :
10.1109/EuroSimE.2015.7103093
Filename :
7103093
Link To Document :
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