DocumentCode :
708071
Title :
Surrogate model based mechanical characterization of lead-free soldered joint material exhibiting ratcheting behavior: An advanced methodology
Author :
Dompierre, Benoit ; Barriere, Ludovic ; Francois, Arnaud ; Wyart, Eric
Author_Institution :
Metallic Struct. & Processes Team, Cenaero ASBL, Gosselies, Belgium
fYear :
2015
fDate :
19-22 April 2015
Firstpage :
1
Lastpage :
5
Abstract :
This study is focused on the methodology dedicated to the identification of parameters of a general Chaboche model [1] for a nanosilver sintered material. This material is used, in particular, for die-attachment in power electronics applications under harsh temperature conditions. This material model is an elastic-viscous-plastic constitutive model accounting for creep and kinematic hardening mechanisms which underlie ratcheting behavior. The proposed methodology relies on an evolutionary algorithm which is coupled with state-of-the-art surrogate modeling. The implemented procedure enables an efficient and robust identification of the parameters of the constitutive model. The methodology is applied to the characterization of a sintered nanosilver joint. Experimental data are extracted from literature in the case of a classical lap-shear test [2]. The Chaboche model is identified for three temperatures from 25°C to 325°C. A monotonic variation of the parameters in function of the temperature is imposed in order to ease the interpolation of parameters inside the temperature range. The parameters identified for the Chaboche model present a better correlation with experiments for each temperature than the Ohno-Wang and Anand constitutive models identified in [2].
Keywords :
creep; evolutionary computation; hardening; kinematics; lead; microassembling; parameter estimation; power electronics; sintering; soldering; Anand; Ohno-Wang; Pb; advanced methodology; constitutive model; creep; die-attachment; elastic-viscous plastic constitutive model; evolutionary algorithm; general Chaboche model; harsh temperature conditions; kinematic hardening mechanisms; lap-shear test; lead-free soldered joint material; mechanical characterization; monotonic variation; nanosilver sintered material; parameter identification; power electronic applications; ratcheting behavior; surrogate model; temperature 25 degC to 325 degC; Analytical models; Computational modeling; Force; Lead;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
Type :
conf
DOI :
10.1109/EuroSimE.2015.7103097
Filename :
7103097
Link To Document :
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