Title :
Modeling of LED solder joint cracking during temperature cycling with Finite Element
Author :
Yuan, W. ; Altieri-Weimar, P.
Author_Institution :
Osram Opto Semicond. GmbH, Regensburg, Germany
Abstract :
In this study a new simulative and analytic method is developed to determine the failure of LED package solder joints at temperature cycling (TC). The solder joint reliability is calculated using a crack growth model, which is based on a combination of cohesive zone modeling and solder creep simulation in FE-model. The crack growth model is calibrated using shear test data after TC loading. The reliability model is validated by means of TC experimental results for three different TC conditions.
Keywords :
finite element analysis; light emitting diodes; solders; thermal management (packaging); FE-model; LED solder joint cracking; cohesive zone modeling; crack growth model; finite element; shear test data; solder creep simulation; solder joint reliability; temperature cycling; Deformable models; Force; Joints; Light emitting diodes; Load modeling; Predictive models; Reliability;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
DOI :
10.1109/EuroSimE.2015.7103105
