Title :
Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics
Author :
Hartmann, Steffen ; Shaporin, Alexey ; Hermann, Sascha ; Bonitz, Jens ; Heggen, Marc ; Meszmer, Peter ; Sturm, Heinz ; Holck, Ole ; Blaudeck, Thomas ; Schulz, Stefan E. ; Mehner, Jan ; Gessner, Thomas ; Wunderle, Bernhard
Author_Institution :
Tech. Univ. Chemnitz, Chemnitz, Germany
Abstract :
In this paper we present results of our recent efforts to understand the mechanical interface behaviour of single-walled carbon nanotubes (CNTs) embedded in metal matrices. We conducted experimental pull-out tests of CNTs embedded in Pd or Au and found maximum forces in the range 10-102 nN. These values are in good agreement with forces obtained from molecular dynamics simulations taking into account surface functional groups (SFGs) covalently linked to the CNT material. The dominant failure mode in experiment is a CNT rupture, which can be explained with the presence of SFGs. To qualify the existence of SFGs on our used CNT material, we pursue investigations by means of fluorescence labeling of surface species in combination with Raman imaging. We also report of a tensile test system to perform pull-out tests inside a transmission electron microscope to obtain in situ images of CNT-metal interfaces under mechanical loads at the atomic scale.
Keywords :
Raman spectra; fluorescence; gold; molecular dynamics method; nanosensors; palladium; reliability; single-wall carbon nanotubes; tensile testing; transmission electron microscopy; C-Au; C-Pd; CNT material; CNT rupture; CNT-based sensor application; CNT-metal interface; Raman imaging; SFG; atomic scale; fluorescence labeling; in situ experiment; in situ image; mechanical interface behaviour; mechanical load; metal matrices; molecular dynamics simulation; nanoreliability; pull-out test; single walled carbon nanotube; surface functional group; surface species; tensile test system; transmission electron microscope; Metallization; Reliability; Silicon;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
DOI :
10.1109/EuroSimE.2015.7103119