Title :
Model verification of heat exchangers in a flow test rig
Author :
Brinkfeldt, Klas ; Aklint, Thorbjorn ; Neumaier, Klaus ; Zschieschang, Olaf ; Edwards, Michael ; Andersson, Dag
Author_Institution :
Swerea IVF, Mölndal, Sweden
Abstract :
In power electronics, more efficient removal of heat from the junction of power devices leads to a higher power rating per die, which in turn leads to fewer die and reduced system volume. Since temperature is a main driver in expected failure modes an increase in cooling capability can also enhance margins of the device reliability.
Keywords :
cooling; heat exchangers; heat sinks; power electronics; thermal management (packaging); device reliability; flow test rig; heat exchangers; model verification; power device junction; power electronics; Fluid flow measurement; Reliability; Resistance heating; Switches; Temperature measurement; Thermal management;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
Conference_Location :
Budapest
Print_ISBN :
978-1-4799-9949-1
DOI :
10.1109/EuroSimE.2015.7103135
